詞語：underfill
underfill的解釋
underfilln. 未充滿；填充不足
underfill的意思
Underfill 底部填充;底部填充膠;底部填充劑;材料;Underfill dispensing 點膠式底部填充;underfill theory 充盈不足學說;upset underfill 加厚端未充滿;Underfill Crack 底部填充裂縫;
underfill的參考例句
1.This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out. 這使得完整意義上說，這是其次的圖片現代芯片的顛簸和底層指出。
2.This thesis is focus on the problem of warpage in flip-chip package due to the CTE mismatch between die, substrate, and bump using various underfill materials. 中文摘要本論文針對覆晶封裝製程中，因為晶片、基板、凸塊和底膠材料都之不同，當溫度變化時，所產生的熱膨脹效應使得整個封裝出現翹曲變形的現象。
3.However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated. 然由於晶圓級構裝不填注底膠，因此當晶圓級構裝於組裝PCB基板後承受熱循環負載時，焊錫接點可靠度已成為構裝結構主要可靠度問題之一。